Click here to purchase
The purpose of these examinations is to check the internal materials, construction and workmanship of film and hybrid integrated circuits (F and HFICs). These examinations will normally be used prior to tapping or encapsulation to detect and eliminate the F and HFICs with internal defects that could lead to device failure in normal application. Other acceptance criteria may be agreed upon with the purchaser or supplier, respectively.
Product Details
- Edition:
- 1.0
- Published:
- 03/01/1994
- Number of Pages:
- 55
- File Size:
- 1 file , 2 MB